Final product
-Braking system, steering system, power system, new energy motor system, battery management system, inverter, automatic driving assistance system (radar, camera), body electronics, in-vehicle entertainment facilities, navigation, etc.

WUS PCB technology
--Double-sided to twelve-layer through-hole board, mechanical blind hole, HDI, HF/RF mixed pressure board, semi-bending board, 3~6oz thick copper board, ceramic board, copper block board, etc.

Final product
-DC-DC converter, high-end equipment/computer power supply

WUS PCB technology
--Thick copper (3 oz ~ 12 oz), up to 20 layers

Final product
-High-end servers and industrial computers

WUS PCB technology
--Up to 40-layer through-hole board, size up to 24X42 inches

Final product
-Base stations (4G, 5G, WiMax, LTE), antennas, filters and power amplifiers

WUS PCB technology
--Layers 2~64, blind buried vias, HDI, backplane, line card/daughter card, back drill, radiator (copper block bonding, buried/embedded copper block, pre-bonding copper block, post-bonding copper Block), Teflon (PTFE material), ceramic filling material, groove/step groove, multi-material whole surface mixed pressure/partial mixed pressure, buried volume technology

Final product
-High-end routers, switches and storage (cloud computing)

WUS PCB technology
--Up to 64-layer backplane, HDI, up to 64-layer high-tech through-hole plate, back drill

Final product
-Design customized products for chips, emulators, ATE test related products, burn-in test related products, wafer test carrier board and probe card carrier board

WUS PCB technology
--Multiple pressing, HDI, POFV (VIPPO), back drilling, 14-layer and above through-hole boards

Final product
-Power control, temperature and humidity control, factory automation, construction machinery, office equipment

WUS PCB technology
--Double-sided to sixteen-layer through-hole board, mechanical blind hole, HDI, semi-bending board, 3~6oz thick copper board, etc.